Intel Ethernet Converged Network Adapter X710-DA2 - Network adapter - PCIe 3.0 x8 low profile - 10 Gigabit SFP+ x 2

£7.495
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Intel Ethernet Converged Network Adapter X710-DA2 - Network adapter - PCIe 3.0 x8 low profile - 10 Gigabit SFP+ x 2

Intel Ethernet Converged Network Adapter X710-DA2 - Network adapter - PCIe 3.0 x8 low profile - 10 Gigabit SFP+ x 2

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From a performance perspective, the Intel X710-DA2 OCP NIC 3.0 performs just as we would expect. We have been using Intel’s X700 series NICs for over six years now (see Intel Fortville Lower Power Consumption and Heat as an example) so the driver support is very good. There was a Fortville re-spin to fix an early bug, but cards like this OCP NIC 3.0 form factor are all built many years after that occurred. It is something we do not worry about these days. Flexible technology options The host-based virtualization technologies supported by Intel VT include VMDq for Emulated Path: Adapter-based Queue sorting enabling efficient hypervisor-based switching

Next-generation VMDq: The X710 adapters support up to 256 VMDq VMs and offer enhanced Quality of Service (QoS) feature by providing weighted round-robin servicing for the Tx data. The adapters offload the data-sorting functionality from the hypervisor to the network silicon, which improves data throughput and CPU usage.SFP+ Modules (S26361-F3986-E3 / -L3) for MMF SR fiber optic or SFP+ Twinax cables (from switch vendors) can be plugged There are a number of changes in the OCP NIC 3.0 form factor which are extremely important to the server sector. The first example is the I/O connector edge of the NIC. Here we can see two SFP+ 10GbE ports. There is another small, but important detail. With the OCP NIC 3.0 form factor there is a new orientation which means we get the I/O faceplate assembly built-into the NIC. With OCP NIC 2.0 form factors, the server vendors had to design this faceplate themselves. Intel X710 DA2 OCP NIC 3.0 Ports

Other brands of SFP+ optical modules will not work with the Intel® Ethernet Converged Network Adapter X710 Series. Note: Installation of Intel® PROSet is optional. Intel® PROSet software includes Intel® PROSet for Windows* Device Manager, Intel® PROSet Adapter Configuration Utility (Intel® PROSet ACU) , and Intel® PROSet for Windows PowerShell* software. For more information on Intel® PROSet, please review the “Microsoft* Windows* Driver and Software Installation and Configuration” section of the Intel® Ethernet Adapters and Devices User Guide. IPv4, IPv6 and mixed IPv4/IPv6 network protocols, IEEE 802.1p Class of Service, IEEE 802.1q VLAN, IEEE 802.1Qaz Enhanced Transmission Selection (ETS), IEEE 802.3ae 10Gbit Ethernet, IEEE 802.3x Flow Control, IEEE 802.1as Timing and Synchronization, IEEE 1588 Precision Time Protocol, IEEE 802.3az Energy Efficient Ethernet (EEE), SFF 8431 SFP+Governing Law; Jurisdiction. This Agreement is governed by USA and Delaware law without regard to conflict of laws principles. The United Nations Convention on Contracts for the International Sale of Goods does not apply. Except for claims for misappropriation of trade secrets or breach of confidentiality obligations, all disputes and actions arising out of or related to this Agreement are subject to the exclusive jurisdiction of the state and federal courts in Wilmington, Delaware and you consent to personal jurisdiction in those courts. Intel X710 2x10GbE SFP+ Adapter, 81Y3520 (withdrawn) is supported in the x3850 X6 and x3950 X6 - System x server support section Scalable performance Cost-and energy-efficient design delivers superior performance with a theoretical throughput of 40 Gb/s (20 Gb/s Tx; 20Gb/s Rx) bidirectional throughput

https://www.intel.com/content/www/us/en/support/articles/000007022/network-and-i-o/ethernet-products.html We can see the NICs are using the Intel i40e driver, which is Intel’s mainstream Fortville driver shared with the XL710 series and even the X722 PCH networking options found in Xeon Scalable platforms and the embedded NICs in the Xeon D-2100 series. We can also see SR-IOV support. CONFIDENTIALITY. This Agreement and the Materials are Intel confidential information and subject to Your valid corporate non-disclosure agreement with Intel (CNDA). Except as authorized in Section 2.1, you must not disclose this information to anyone, including the U.S. government. This Agreement will not become effective, or will automatically terminate, in the absence of a CNDA. Dispute Resolution. If we have a dispute regarding this Agreement (other than a dispute over misappropriation of trade secrets or breaches of confidentiality obligations), neither of us can file a lawsuit or other regulatory proceeding unless the complaining party provides the other party a detailed notice of the dispute and our senior managers attempt to resolve the dispute. If we can’t resolve the dispute in 30 days, either of us may demand mediation and will then try to resolve the dispute with an impartial mediator. If we don’t resolve the dispute within 60 days after the mediation demand, either of us may begin litigation.

Virtual Machine Device Queues (VMDq)

The card we are looking at is the Intel X710DA2OCPV3. Server vendors re-brand this part. As an example, Dell says this is a W35V7 / Dell Part 540-BCOU. There is also an Intel X710DA4OCPV3 part which is the quad-port version of this card. We previously looked at a Intel X710-DA4 NIC if you want to see more about that solution in a traditional PCIe form factor. There is a notable difference. Technically this card is using the X710-BM2 controller (X710 2-port) while the DA4 version is using an XL710-BM1 essentially an XL710 40Gbps single port solution split into four 10GbE ports. Intel X710 DA2 OCP NIC 3.0 Cover We tested the X710 OCP NIC using two ports on a 1m breakout QSFP+ DAC to our 32-port Arista 40GbE data center switch. We then varied the port speed and connection type and tested transfer speeds from our network storage. Intel X710 OCP NIC 3.0 Performance Your Products” means products developed or to be developed by or for You that include an Intel Component executing the Materials.

Waiver. No waiver of any provision of this Agreement will be valid unless in a writing signed by an authorized representative of the waiving party that specifies the waived provision. That signed waiver will not constitute a waiver of any other provision. A party’s failure or delay in enforcing any provision will not operate as a waiver. License. Subject to the terms of this Agreement, Intel grants to You, for the Term, a limited, nonexclusive, nontransferable, revocable, worldwide, fully paid-up license under Intel’s intellectual property rights in the Materials, without the right to sublicense, to use the Materials in the development of Your Products, including modifying Materials delivered as source code, and distributing the Materials, including Your modifications, in object form, embedded in or for execution on Your Product and under terms and conditions consistent with Your rights and obligations under this Agreement. You may disclose the Materials to Your subcontractor for its work on Your Products under an agreement preventing the subcontractor from disclosing the Materials to others. Removed Brocade 10Gb SFP+ SR Optical Transceiver, 49Y4216 as not supported - Supported transceivers and cables section

Intel X710-DA2 OCP NIC 3.0 Dual 10GbE NIC Overview

PCI-SIG SR-IOV implementation: Provides an implementation of the PCI-SIG standard for I/O Virtualization. The physical configuration of each port is divided into multiple virtual ports. Each virtual port is assigned to an individual VM directly by bypassing the virtual switch in the Hypervisor, which results in near-native performance. Compliance with Laws. The Materials are subject to export controls under applicable government laws and regulations, including in the U.S. You must comply with applicable laws and regulations, including U.S. and worldwide export regulations. You must not export, import, or transfer the Materials to any prohibited or sanctioned country, person, or entity. You must not use the Materials for the development, design, manufacture, or production of nuclear, missile, chemical, or biological weapons. Cost-and energy-efficient design delivers superior performance with a theoretical throughput of 40 Gb/s (20 Gb/s Tx; 20Gb/s Rx) bidirectional throughput Status: Cap+ 66MHz- UDF- FastB2B- ParErr- DEVSEL=fast >TAbort- SERR-

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